Santa Clara, CA. November 22nd 2013
A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create MicroVia structures greater than 3 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing, this MicroVia technology is a cost effective route for advanced technology.
V-Stacks: Patented MicroVia technology that will change everything
2013 Investments completed, looking to 2014 & beyond...
A majority of PCB shops are riding the wave of technology, many of which are attempting to produce products that are above and beyond their capabilities. This has caused product inconsistency and reliability issues for PCB buyers. Streamline, however, is looking to 2014 and beyond with a sharp focus in tomorrow's Micro BGA technology today, with chipsets as small as .3mm and .19mm currently in the facility.
Streamline Circuits Corp., a leading provider of high quality Printed Circuit Boards, offering Rigid, Rigid-Flex and Multilayer Flex, has seen significant growth over the past year. We are committed to providing our customers the most advanced technology, quality and engineering support available. Customers utilize these resources to develop a cost effective product in a time sensitive manner. This is critical for today's customers who want and need to get their quality products to market first.